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人参与 | 时间：2026-06-18 05:11:10
良率突破将使苹果M3芯片的台积量产进度大幅提前，业内人士指出，电纳台积电3纳米（N3）工艺良率已突破90%大关，米工台积电N3工艺在晶体管密度和能效比上相比N5提升约30%，艺良这一里程碑意味着台积电在先进制程量产上取得关键突破，率突量产预计2024年下半年搭载该芯片的破加新款MacBook Pro将如期上市。较此前70%左右的速苹水平大幅跃升。此次良率达标将吸引更多客户如AMD、芯片台积来源：Digitimes
据半导体行业最新消息，电纳有望显著降低芯片成本并扩大产能。米工英伟达等加速订单。艺良 顶: 44踩: 3
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